Silicone Foam PCB Lamination Pad, Sulfur-Free No Silicone Oil Bleed for Multilayer PCB Hot Press
Conventional gaskets exhibit oil leakage at high temperatures, collapse and loss of elasticity after repeated compression.
Uniform Micro-Cell Foam： Uniform micro-cell foam, even pressure buffer, eliminate PCB dent & bubble defects.
High Thermal Stability: Withstand 180~230℃ continuous hot pressing, no collapse after multiple cycles.
Sulfur-Free Silicone Sponge :Low outgassing, no silicone oil migration, protect copper foil from pollution, cleanroom qualified.Pass RoHS
Honor and qualification
Official certification, professional after sales service.
ROHS Certificate (closed cell silicone foam)
V-0 Certificate
FDA Certificate
ROHS Certificate (open cell silicone sponge)
REACH Certificate
Our factory & quipment
"Pursue excellence with a down-to-earth attitude"
Get Your Custom Solution Today!
👉 Contact us now via email (ulawang@spsilicone.com) or the form below to claim your free sample and technical consultation!
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