PCB Heat Lamination Buffer Pad

Feature of Sanpu Silicone Sponge Pad:

  1.High Temperature Resistance & Thermal Stability Properties：Non-powdering and no hardening after repeated high-temperature lamination

  2.Low Contamination & Environmentally Friendly: Pass RoHS and FDA

  3.Closed-Cell Structure:During the lamination process, water vapor released by the boards will not be absorbed and can be discharged smoothly, reducing defects such as bubbles, white spots and delamination.

  4.Chemical stability: It does not react with epoxy resin or PP prepreg resin and will not corrode copper foil.

Advantage of Silicone Sponge As PCB heat lamination buffer pad

1. Excellent physical resilience to compensate copper thickness difference and board unevenness
2. Uniform pressure distribution, less delamination, void, copper indentation defects
3. High temperature resistance and stable thermal performance
4. Closed-cell structure for good moisture exhaust
5. Low sulfur & low volatiles, low contamination, clean production
6. Reusable, tear-resistant, wide compatibility for HDI, heavy copper, step PCB

Choose Sanpu Silicone 

 1.We are an original silicone sponge supplier

 2.We have more than 16 years' experience of silicone sponge production 

 3.Mandatory inspection before leaving the factory,quality inspection report is attached

 4.Free samples, contact us to get free sample