PCB Hot-pressed Buffer Pad

Feature of Sanpu Silicone Sponge Pad:

  1.Physical Resilience：Unfiorm foam, uniform thickness.

  2.High Temperature Resistance & Thermal Stability Properties：wide temperature resistance range---60~250 ℃

  3.Low Contamination & Environmentally Friendly: Pass RoHS 

  4.Closed-Cell Structure

Advantage of Silicone Sponge As PCB Hot-pressed Buffer Pad

1.Extraneously high rebound capability compensates for variations in plate thickness and copper layer thickness, significantly enhancing product reliability while reducing rework and scrap rates.

2.Soft bonding significantly reduces pressure damage, dents, and adhesive deficiency on copper surfaces.

3.The pressure distribution is highly uniform across the thick copper/convex-concave plate surface.

4. Controlled thermal conductivity to mitigate warping caused by temperature fluctuations between high and low temperatures

Choose Sanpu Silicone ,choose reliability

 1.Original silicone sponge supplier

 2.More than 16 years' experience of silicone sponge production 

 3.Mandatory inspection before leaving the factory,quality inspection report is attached

 4.Quality commitment

 5.Free samples for PCB Hot-pressed Buffer Pad, contact us to get free sample